PCB De-paneling and the use of Laser Technologies – Is it the Future
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március 30.
2023
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Földszinti színpad
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Az előadás angol nyelven zajlik!
PCB De-paneling is designed to delivery accurate PCB outlines, with all parts and joints intact, at rates of output that match or exceed the SMT lines they follow – more than ever they have become an inline rather than batch processes, fully integrated to systems that include robotic handling and full systems integration to MES and other shop floor systems. For many years the cutting systems were all Mechanical and at some level exerted bending loads, stress, on the PCB. Stress is problematic if it is uncontrolled resulting in immediate failures or worse, failures in the fieled that present at a later date.
Lasrer technology is a non contact cutting method – the cutting is done by the use of a light beam and so the stress imparted is zero – the ideal solution?
This presentation reviews the current methods of Depanelling and introduces the laser technologies as a possible alternative in both small and large volume environments.
Today Lasers are more common but their use has to be careflyy weighed against a variety of factors before dismissing the more tradition technologies.
