In order for these components to achieve a long service life and trouble-free operation, the heat generated must be dissipated efficiently. The most common solutions for the electronic production are Gap filler liquids with different characteristics in thermal conductivity (W/mK), viscosity and abrasiveness. These challenging material properties require special attention to material preparation and dispensing technology.

Topics covered:

  • Typical applications for thermal interface materials
  • Dispensing technology for abrasive materials
  • Process reliability and monitoring