Next level dispensing solutions for thermal interface applications
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29 March
2023
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Ground floor stage
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Thermal management or rather thermal connectivity and cooling of electrical components play an important role in electronic production since components are becoming increasingly powerful and smaller.
In order for these components to achieve a long service life and trouble-free operation, the heat generated must be dissipated efficiently. The most common solutions for the electronic production are Gap filler liquids with different characteristics in thermal conductivity (W/mK), viscosity and abrasiveness. These challenging material properties require special attention to material preparation and dispensing technology.
Topics covered:
- Typical applications for thermal interface materials
- Dispensing technology for abrasive materials
- Process reliability and monitoring
