Dr. Hans-Peter Tranitz

IPC Electronics Europe GmbH, Senior Director Technology Solutions

In October 2022, Peter joined the newly installed IPC Electronics Europe GmbH in Munich as Senior Director Technology Solutions. In this function he participated already at the IEEE Electronic System-Integration Technology Conference in Sibiu, the IPC – Advanced Packaging Symposium in Washington, DC and the iMAPS Device Packaging Conference in Phoenix, AZ.

In addition to his Advanced Packaging activities, Peter uses his expertise to drive Design for Excellence and e-Mobility initiatives.

Peter is a PhD in Physics. During his postdoc time in Cincinnati and Regensburg and a short assignment at Infineon in Dresden, he gained experience in semiconductor manufacturing and characterization. The 18 years before his transition to IPC, Peter worked at Continental Automotive as Principal Expert and department head for the development and standardization of electro-mechanical manufacturing technologies. During his academia and industry assignments he published more then 70 papers and issued several patents.

Advanced Packaging – Current Situation and IPC Initiatives

29 March

10.30

2023

Helyszín

Ground floor stage

Szekció

Industry trends

Increasing semiconductor’s performance by downscaling sizes and increasing densities of transistors on a single chip is coming to its physical end. New technologies have been introduced since about 10 years which are called Advanced Packaging and Heterogeneous Integration.